According to application scenarios, plating machines can be classified into four main types:
Rack Plating Machines – Designed for medium to large precision parts such as automotive components and electronic connectors. Custom racks ensure uniform coating thickness.
Barrel Plating Machines – Suitable for mass plating of small parts like screws and electronic components. Perforated rotating barrels provide high-efficiency tumbling for even metal deposition.
Continuous Plating Machines – Used for strip or wire materials such as PCB copper foil and copper wire. Multiple connected tanks and precise tension control enable high-speed, continuous production.
Selective Plating Machines (Brush Plating Equipment) – Allow localized coating or repair of specific areas on complex-shaped workpieces, offering exceptional flexibility.

The equipment typically consists of four core systems:
Power Supply: Provides adjustable DC voltage (0–24V) and current up to several thousand amperes to meet the requirements of different plating types.
Electrolytic Tank: Constructed from corrosion-resistant materials such as PP or PVDF, often with double-layer leak-proof designs and capacities ranging from 0.5 to 10 m³.
Electrode System: The anode uses either soluble metals or insoluble titanium baskets, while cathode fixtures are customized to match workpiece geometry, minimizing contact resistance (<0.1Ω).
Control System: Offers ±1°C temperature control, ±0.1 pH monitoring, and plating thickness management to ensure process stability.

Advantages:
The machine supports one-touch parameter settings for easy operation. The resulting coatings feature low porosity and high adhesion strength, ensuring excellent quality. Equipped with PLC and touchscreen interfaces, the system achieves a high degree of automation and process optimization—making it an indispensable surface treatment solution in modern manufacturing.