Core Structure:

The gold plating production line consists of five main systems:
Pre-treatment System – The foundation of the process, ensuring clean and stable substrates through:
Degreasing to remove oils and surface contaminants,Pickling to eliminate oxides, and Pre-plating (such as nickel underplating) to enhance gold adhesion and prevent peeling.
Electrolytic System – The core of the line, including:
Corrosion-resistant plating tanks made of PP or PVDF, filled with either cyanide-based or cyanide-free gold electrolytes (the latter being more environmentally friendly),Insoluble titanium mesh anodes to prevent electrolyte contamination, and A low-voltage, high-precision DC power supply (1–5V output) for uniform and controlled gold deposition.
Post-treatment System – Ensures coating quality and protection through:
Multi-stage rinsing to remove residual electrolyte and prevent gold corrosion,Drying at ambient or low temperature to preserve luster, and Thickness inspection using precision gauges with ±0.1 μm accuracy.
Conveying System – Employs precision racks or conveyor belts to ensure smooth and orderly transfer of small workpieces through each stage.
Control System – Operated via PLC and touchscreen interface, enabling real-time monitoring of electrolyte temperature (25–40°C), pH value (±0.2), and deposition time to maintain precise process parameters.

Key Advantages:
The gold layer offers superior electrical conductivity, ideal for high-frequency electronic components; excellent chemical resistance to acids and alkalis, suitable for harsh environments; and premium decorative and intrinsic value as a noble metal. With precisely controlled thickness (0.1–5 μm) balancing performance and cost, the gold plating production line is a key piece of equipment in high-end manufacturing for both functional enhancement and aesthetic excellence.