A tin plating production line is a specialized surface treatment system that deposits a tin layer onto metal workpieces—typically made of copper, iron, or steel—through electrolytic plating or hot-dip coating. Leveraging tin’s excellent solderability, low toxicity, and moderate corrosion resistance, the system enhances both weldability and protective performance of components. It is widely used in the electronics, food packaging, hardware, and electrical industries—ideal for electronic component leads, PCB boards, food cans, and wire or cable connectors that require reliable soldering or protective finishes.
Core Structure:
The tin plating production line consists of five main systems:
Pre-treatment System – The foundation of the process, ensuring a clean and contaminant-free surface through:
Degreasing to remove oil and surface residues,Pickling to eliminate metal oxides (with specialized copper oxide removal for copper substrates), and Activation to improve surface adsorption, ensuring firm adhesion of the tin layer.
Electrolytic System – The core section (used in mainstream processes), including:
Corrosion-resistant plating tanks made of PP or PVC, containing acidic or alkaline tin salt electrolytes,Soluble tin anodes that replenish tin ions in the electrolyte, and A low-voltage DC power supply (1–8V output) to precisely control the uniform deposition of the tin coating.
Post-treatment System – Ensures coating stability and durability through:
Multi-stage rinsing to remove residual electrolyte and prevent corrosion,Passivation (optional) to enhance corrosion resistance, and Low-temperature drying to prevent oxidation of the tin layer.
Conveying System – Utilizes precision racks (for large or delicate components) or rotary barrels (for small batch parts), enabling efficient and orderly transfer of workpieces between process stages.
Control System – Managed by a PLC and touchscreen interface, allowing real-time monitoring of electrolyte temperature (25–45°C), pH value (±0.2), and tin coating thickness (±0.5 μm accuracy) to ensure stable production performance.
Key Advantages:
The tin coating provides excellent solderability, meeting the needs of efficient electronic assembly; it is non-toxic, making it suitable for food-contact applications; and it offers a cost-effective alternative to precious metal coatings, balancing economic and functional performance. With a flexibly adjustable thickness (1–20 μm) to meet diverse protection and soldering requirements, the tin plating production line serves as a vital surface finishing system in both electronics manufacturing and consumer product industries.
